FILM TYPE PHOTODEGRADABLE TRANSFER MATERIAL

摘要

Disclosed herein is a film-type photodegradable transfer material, comprising: a support film; a resin protection layer; a photodegradable photoresist layer; and a cover film, wherein the resin protection layer has an adhesion force of 0.05 kgf or less. When the film-type photodegradable transfer material is used to form a fine circuit pattern, such as a printed circuit board or the like, the resolution of the pattern can be increased by minimizing the distance between a mask and a photosensitive resin layer at the time of exposure, and work can be performed in the form of a sheet or a roll to roll process can be applied to the work even when the support film has been removed before an exposure process.