HEAT-HARDENED RESIN COMPOSITION AND PRINTED WIRING BOARD

摘要

Provided are a heat-hardened resin composition which can form a conductive layer having high adhesive strength with a resin insulation layer when a conductive layer is formed on the surface of a resin insulation layer by a plating process, a resin sheet composed of the heat-hardened resin composition, and a printed wiring board which forms a resin insulation layer by using the composition and the sheet. In the manufacture of a printed wiring board which forms a conductive layer by a plating process after ultraviolet light irradiates the surface of a resin insulation layer, the heat-hardened resin composition used to form the resin insulation layer includes at least one of either a bifunctional epoxy resin which does not include a naphthalene skeleton or an epoxy resin which does not include a naphthalene skeleton which has an epoxy equivalent greater than 250 g/eq with three or more epoxy bases in one molecule, and includes phenol resin, filler, and polyhydroxycarboxylic acid or a derivative thereof.