| 摘要 |
PROBLEM TO BE SOLVED: To provide a coating apparatus capable of performing stable high-speed rotation of a substrate, and to provide a coating method that ensures to form a coating on the substrate while performing stable high-speed rotation of the substrate. SOLUTION: A coating apparatus 100 has a susceptor 102 for supporting a silicon wafer 101, and a rotating portion 104 for rotating the susceptor 102. The rotating portion 104 is covered on top with the susceptor 102 to form a P<SB>2</SB>region. The contact surface 105 of the susceptor 102 with the silicon wafer 101 has many holes 106 therein. The silicon wafer 101 is attached to the susceptor 102 by evacuating gas from the P<SB>2</SB>region. COPYRIGHT: (C)2010,JPO&INPIT |
