发明名称 |
ELECTROLESS NICKEL LEVELING OF LGA PAD SITES FOR HIGH PERFORMANCE ORGANIC LGA |
摘要 |
A structure comprises: a substrate; at least one conductor on the substrate; at least one contact pad on the substrate; a mask over the conductor (wherein the mask comprises an opening over the contact pad and wherein the mask comprises a bottom surface contacting the substrate and a top surface opposite the bottom surface); and a contact pad plating layer on the contact pad and within the opening of the mask. The contact pad plating layer comprises a bottom surface contacting the contact pad and a top surface opposite the bottom surface, and the top surface of the contact pad plating layer is coplanar with the top surface of the mask.
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申请公布号 |
US2009294971(A1) |
申请公布日期 |
2009.12.03 |
申请号 |
US20080131298 |
申请日期 |
2008.06.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BLACKSHEAR EDMUND D.;RUSSELL DAVID J.;DORE KEVIN A. |
分类号 |
H01L23/488;H01L21/44 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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