发明名称 |
METHOD OF GRINDING SEMICONDUCTOR WAFERS AND DEVICE FOR GRINDING BOTH SURFACES OF SEMICONDUCTOR WAFERS |
摘要 |
A method of grinding semiconductor wafers including simultaneously grinding both surfaces of multiple semiconductor wafers being ground by rotating the multiple semiconductor wafers between a pair of upper and lower rotating surface plates in a state where the multiple wafers are held on a carrier so that centers of the multiple wafers are positioned on a circumference of a single circle, wherein a ratio of an area of a circle passing through the centers of the multiple wafers to an area of one of the multiple wafers is greater than or equal to 1.33 but less than 2.0; a rotational speed of the multiple wafers falls within a range of 5 to 80 rpm; and the grinding of the multiple wafers with the rotating surface plates are conducted with fixed abrasive grains in the presence of an alkali solution.
|
申请公布号 |
US2009298397(A1) |
申请公布日期 |
2009.12.03 |
申请号 |
US20090470961 |
申请日期 |
2009.05.22 |
申请人 |
SUMCO CORPORATION |
发明人 |
YAMADA YASUNORI;KAKIZONO YUICHI;TAKAISHI KAZUSHIGE |
分类号 |
B24B7/26;B24B1/00;B24B7/04;B24B7/17;H01L21/304 |
主分类号 |
B24B7/26 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|