发明名称 |
POLISHING END POINT DETECTION METHOD |
摘要 |
A method for detecting an end point of a polishing operation (e.g., a polishing stop point or a changing point of polishing conditions) of a film of a substrate is described. The method includes applying light to a surface of a substrate during polishing of the substrate; receiving reflected light from the surface of the substrate, monitoring a first characteristic value and a second characteristic value calculated from reflection intensities at different wavelengths; detecting a point when an extremal point of the first characteristic value and an extremal point of the second characteristic value appear within a predetermined time difference; after detecting the point, detecting a predetermined extremal point of the first characteristic value or the second characteristic value; and determining a polishing end point based on a point when the predetermined extremal point is detected.
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申请公布号 |
US2009298387(A1) |
申请公布日期 |
2009.12.03 |
申请号 |
US20090476427 |
申请日期 |
2009.06.02 |
申请人 |
SHIMIZU NOBURU;OHTA SHINROU |
发明人 |
SHIMIZU NOBURU;OHTA SHINROU |
分类号 |
B24B49/02;B24B37/013;B24B49/12;H01L21/304 |
主分类号 |
B24B49/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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