发明名称 POLISHING DEVICE AND POLISHING METHOD FOR CONTROLLING HIGH PRECISION FLATTENING
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing device capable of transferring shapes of surfaces of upper and lower polishing plates 10 and 11 to be polished on the surface of a work 12 to be processed while maintaining the shapes in such a manner that the flattening accuracy and surface roughness of the work 12 after processing reach predetermined values. <P>SOLUTION: In this flat surface polishing device, frictional resistance between the work 12 under processing and the upper polishing plate 10 and frictional resistance between the work and the lower polishing plate 11 are detected by detecting the current value of a motor which drives each shaft. While detecting rotational speeds of the upper and lower polishing plates, the supply amount of an abrasive, and processing pressure applied to the work 12 so that a preset current value can be obtained, the device controls loads on the surface of the work 12 to be processed from the upper polishing plate 10 and the lower polishing plate 11, the processing speed, and the supply amount of the abrasive to be supplied to the processing surface so that the work 12 may have a preset shape. The flattening accuracy and the surface roughness of the work 12 after polishing reach the predetermined values. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009279701(A) 申请公布日期 2009.12.03
申请号 JP20080133888 申请日期 2008.05.22
申请人 HAMAI CO LTD 发明人 WATANABE YASUO;KOBAYASHI AKIRA;TOYODA KAZUHIKO
分类号 B24B37/00;B24B37/005;B24B37/08 主分类号 B24B37/00
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