THERMOSETTING RESIN COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition with which a molding step is simplified.

SOLUTION: In the thermosetting resin composition containing an epoxy resin, a hardening agent and a hardening catalyst, a degree of hardening of the hardened matter obtained by transfer molding the thermosetting resin composition on the condition that the mold temperature is 180°C, and the hardening time period is 90 seconds is essentially equal to that of the hardened matter further subjected to after-cure with heating of 150°C for three hours.

COPYRIGHT: (C)2010,JPO&INPIT