| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board for further securely preventing a soldering land and a lead from not being soldered under control over a further-easy manufacturing process even when lead-free solder having inferior solder wettability is used. Ž<P>SOLUTION: The printed circuit board, on which a surface-mounted component is mounted, includes soldering lands 4 for mounting the surface-mounted component 2 thereon, and also provided with a lattice-like land 6 for reducing the surface tension of solder on the front side in a soldering advancing direction when subjecting the printed wiring board to jet flow-type soldering, when viewed from the soldering lands 4. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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