| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder paste printing method and a mask for solder paste printing, which are capable of stably supplying a volume amount of solder required for each component in one step. Ž<P>SOLUTION: The mask for solder paste printing is constituted by laminating a metal layer 10 and an easily reformable rubber layer 11, and the rubber layer 11 is compressed and deformed by a pressure applied to the mask from a squeegee 30 to make an opening shape of the mask smaller when solder paste printing is performed. The reduction rate of an opening of a minute component is made higher than that of a large-sized component, and a required volume amount of solder according to a size of a component to be mounted is printed in one step using one mask having the same thickness. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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