发明名称 MULTILAYER ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a multilayer electronic component wherein an external terminal electrode formed by direct plating is provided on the outer surface of an electronic component body, along with its manufacturing method, capable of efficiently discharging internal water content by thermal treatment, resulting in reduced degradation of characteristics and ensuring excellent durability. Ž<P>SOLUTION: External terminal electrodes 1 and 2 comprise base material plating films 1a and 2a formed by direct plating on the outside surface of an electronic component body so as to connect to the exposed portions of internal conductors (internal electrodes) 41 and 42. The average particle size of metal particles constituting the base material plating films 1a and 2a is 0.5 μm or less. The external terminal electrodes comprise one or more upper layer plating films 1b(2b) and 1c(2c) formed on the base material plating films. The average particle size of metal particles constituting the upper layer plating films is 0.5 μm or less. The metal particle constituting the base material plating films is Cu particle. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009283598(A) 申请公布日期 2009.12.03
申请号 JP20080132871 申请日期 2008.05.21
申请人 MURATA MFG CO LTD 发明人 KAWASAKI KENICHI;TAKEUCHI SHUNSUKE;MOTOKI AKIHIRO;OGAWA MAKOTO;IWANAGA TOSHIYUKI
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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