Method of yield management for semiconductor manufacture and apparatus thereof

摘要

A method of yield management for semiconductor manufacture and an apparatus thereof are provided. The method includes the following steps. Defect data of a layer of a semiconductor wafer is obtained, wherein the defect data includes sizes and locations of defects with respect to the layer. A layout with respect to the layer is obtained. And a critical area analysis is performed in parallel for the layer by a plurality of processing devices according to the defect data and the layout to determine locations of defects falling into a critical area of the layer among the locations of the defects.