| 摘要 |
A flip-chip electrical coupling between first and second electrical components (250, 260). The coupling includes a bump (210) and a pad (220). The bump (210) is electrically coupled to the first electrical component (250). The pad (220) is electrically coupled to the second electrical component (260). The pad (220) is electrically coupled to and dimensioned smaller than a corresponding coupling surface (214) of the bump (210). The pad (220) and bump (210) may be electrically coupled together using an ultrasonic stub bump bonding process, conductive epoxy, etc. |
