发明名称 METHOD OF PRODUCING SILYLATED POROUS INSULATING FILM, METHOD OF PRODUCING SEMICONDUCTOR DEVICE, AND SILYLATED MATERIAL
摘要 <p>Provided is a method for the effective silylation treatment of a silica-based porous insulating film having a plurality of pores.  The method of producing a silylated porous insulating film (204c) includes a process whereby a porous insulating film (204b) having a plurality of pores is formed, and a process wherein a silylating material vapor (210) obtained by vaporizing silylating material containing organic silane compound having a hydrophobic group and polymerization inhibitor which inhibits the auto-polymerization of said organic silane compound is caused to act upon the porous insulating film (204b)</p>
申请公布号 WO2009144920(A1) 申请公布日期 2009.12.03
申请号 WO2009JP02314 申请日期 2009.05.26
申请人 NEC ELECTRONICS CORPORATION;ULVAC, INC.;KINOSHITA, KEIZO;CHIKAKI, SHINICHI;NAKAYAMA, TAKAHIRO 发明人 KINOSHITA, KEIZO;CHIKAKI, SHINICHI;NAKAYAMA, TAKAHIRO
分类号 H01L21/312;H01L21/3065;H01L21/768;H01L23/522 主分类号 H01L21/312
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