发明名称 |
METHOD OF PRODUCING SILYLATED POROUS INSULATING FILM, METHOD OF PRODUCING SEMICONDUCTOR DEVICE, AND SILYLATED MATERIAL |
摘要 |
<p>Provided is a method for the effective silylation treatment of a silica-based porous insulating film having a plurality of pores. The method of producing a silylated porous insulating film (204c) includes a process whereby a porous insulating film (204b) having a plurality of pores is formed, and a process wherein a silylating material vapor (210) obtained by vaporizing silylating material containing organic silane compound having a hydrophobic group and polymerization inhibitor which inhibits the auto-polymerization of said organic silane compound is caused to act upon the porous insulating film (204b)</p> |
申请公布号 |
WO2009144920(A1) |
申请公布日期 |
2009.12.03 |
申请号 |
WO2009JP02314 |
申请日期 |
2009.05.26 |
申请人 |
NEC ELECTRONICS CORPORATION;ULVAC, INC.;KINOSHITA, KEIZO;CHIKAKI, SHINICHI;NAKAYAMA, TAKAHIRO |
发明人 |
KINOSHITA, KEIZO;CHIKAKI, SHINICHI;NAKAYAMA, TAKAHIRO |
分类号 |
H01L21/312;H01L21/3065;H01L21/768;H01L23/522 |
主分类号 |
H01L21/312 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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