COPPER-FOIL ROUGHENING TREATMENT AND COPPER FOIL FOR PRINTED CIRCUIT BOARDS OBTAINED USING SAID TREATMENT

摘要

Provided is a technique, which can be applied to insulating resin substrates having a low dielectric constant, for forming a roughened copper-foil surface on which fine-pitch wiring circuits can be formed.  The surface of the copper foil which is bonded to the insulating resin substrate is roughened by the precipitation and formation of very fine copper particles on the surface of the copper foil by electrolysis under burnt copper plating conditions using a sulfuric-acid-based copper plating bath containing a quaternary ammonium salt polymer.  The electrolysis is preferably carried out for from 5 to 20 seconds at an average anode current density from 5 A/dm2 to 40 A/dm2 with said sulfuric acid based copper plating bath containing a quaternary ammonium salt polymer at a temperature from 20°C to 40°C.