| 摘要 |
PURPOSE: A sputtering apparatus is provided to prevent a foreign material from being attached on a target by installing a shutter unit to open and close the target so that the target is isolated. CONSTITUTION: In a sputtering apparatus, a deposition target is proved inside a reaction chamber(110). The target(140) offers the deposition material to the deposition target. A shutter units(120,130) open and close the deposition target to the target. A first shutter plate(121) is provided in the one side inside the reaction chamber and is rotatable. A second shutter plate(131) is provided in the other-side inside the reaction chamber and is rotatable. The first driver module operates the first shutter plate.
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