Light emitting apparatus, optical scanning apparatus, and image forming apparatus

摘要

A light emitting apparatus (50) includes a surface emitting laser and a ceramic package (20). The surface emitting laser has a common electrode on the back surface thereof and is mounted on the ceramic package via the common electrode. The common electrode of the surface emitting laser is electrically connected to a mount portion (31) of the ceramic package. The mount portion is electrically connected to a back-surface electrode (32) on the back surface of the ceramic package. The mount portion is also thermally connected to a back-surface heat-dissipating electrode (33) on the back surface of the ceramic package via a penetrating electrode (36) that penetrates the ceramic package. The surface emitting laser is spaced apart from the penetrating electrode in order to prevent inclination in light-emitted direction. The back-surface heat-dissipating electrode prevents destruction of a soldered portion when the light emitting apparatus is mounted on a substrate by soldering.