Wiring substrate and method of manufacturing the same
摘要
<p>There is provided a wiring substrate 1A. The wiring substrate 1A includes a wiring member 30 and a reinforcing layer 50. The wiring member 30 is formed by layering insulating layers and wiring layers and has connection pads 18 thereon. The reinforcing layer 50 is provided on the wiring member 30 to surround the connection pads 18 and has a plurality of concave-convex portions 50a thereon.</p>
