Device for positioning and blocking thin substrates on a cut substrate block

摘要

A device for positioning and holding thin substrates, especially silicon wafers (4), after cutting, preferably wire sawing, a substrate block (13) comprises a cassette (17) having at least two contact strips (20) facing the block-encompassing elements that engage in the narrow cutting gap (15) between the wafers. An independent claim is also included for a method of using the above device.