发明名称 HEAT-ACTIVATED ADHERING PLANAR ELEMENT
摘要 <p>The invention provides a substantially two-dimensional element (2D element) which bonds adhesively without bubbles under heat activation and has at least one heat-activable adhesive, one side face of said element having a groove element. The groove element comprises at least one groove adapted for the transport of a fluid. The groove is set into the side face of the 2D element in such a way that it is open towards the side face. It runs continuously from one edge section of the side face to a further edge section of the side face. By way of the groove structure formed from the at least one groove, liquid or gaseous fluids which form or collect in the bond area can be drained from the plane of the bond, thereby improving the strength of the bond. The invention further offers methods of producing and employing this 2D element.</p>
申请公布号 EP2125983(A1) 申请公布日期 2009.12.02
申请号 EP20080708586 申请日期 2008.02.01
申请人 TESA SE 发明人 HUSEMANN, MARC;HANNEMANN, FRANK
分类号 C09J7/00;C09J7/02 主分类号 C09J7/00
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