PREPREG FOR PRINTED WIRING BOARD AND COPPER-CLAD LAMINATED BOARD

摘要

A prepreg for a printed wiring board characterized with use of a brominated epoxy resin, possessing a peak intensity of infrared absorption spectrum at 2100 to 2300 cm -1 , which is 5% or lower than that of a benzene ring carbon-carbon double bond at 1600 cm -1 as measured with an infrared absorption spectrometer as well as having an inflection point between 120 and 150°C in the cured product of said brominated epoxy resin as measured by means of a differential scanning calorimeter. The prepreg for the printed wiring board is superior in hygroscopicity, heat resistance, and desmear capability as a printed wiring board material and can be used to manufacture a copper-clad laminate board.