| 摘要 |
<p>A multilayer wiring board is provided that is capable of preventing the occurrence of cracking in the vicinity of a connection portion of a conductor pattern disposed inside a basic material layer (in the middle of the basic material layer) and a via-hole conductor even when the conductor pattern is connected to the via-hole conductor. A multilayer wiring board 10 includes basic material layers 30, 32, and 34 and the constrained layers 40, 42, 44, and 46 that are alternately stacked. In the material layer 32, a via-hole conductor 14c is connected to an intermediate conductor pattern 17. An extended portion 15 is formed by extending an end of the via-hole conductor 14c beyond the intermediate conductor pattern 17 inside the basic material layer 32.</p> |
