发明名称 Adhesive compound containing epoxy resin
摘要 <p>Composition comprises at least a reaction product, which is obtained from a reaction mixture comprising at least a mercaptosilane, and at least a polysilane and at least an epoxy resin. An independent claim is included for a method for gluing or sealing two substrates comprising: either applying the composition on a first substrate, applying an adhesive or sealant to the composition, and contacting the adhesive or sealant to a second substrate; and applying the composition on a first substrate, applying an adhesive or sealant on the surface of a second substrate, and contacting the adhesive or sealant with the composition, which is applied on the first substrate; and applying the composition on a first substrate, applying an adhesive or sealant to the first and second substrate, and contacting the applied adhesives or sealants with one another by bonding the substrate parts to the adhesives or sealants; or applying the composition on a first substrate, airing the composition, and applying an adhesive or sealant between the surfaces of the first and second substrate, where the second substrate comprises same or different material as the first substrate.</p>
申请公布号 EP2128210(A1) 申请公布日期 2009.12.02
申请号 EP20080157103 申请日期 2008.05.28
申请人 SIKA TECHNOLOGY AG 发明人 DOHNER, RETO;SCHLUMPF, MICHAEL;DIENER, ANDREAS;HUCK, WOLF-RUEDIGER
分类号 C09J5/02;C08L63/00 主分类号 C09J5/02
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