HEAT RELEASE STRUCTURE OF A PRINTED CIRCUIT BOARD

摘要

PURPOSE: A heat dissipation structure of a printed circuit board is provided to prevent separation between a contact protrusion of a metal plate and an integration circuit by interposing a heat dissipation adhesive between the contact protrusion of the metal plate and the integration circuit. CONSTITUTION: An integration circuit controls a spindle motor, and is arranged in a printed circuit board(110). A first coupling hole and a heat dissipation hole(131) are formed on the printed circuit board. A metal plate(120) is attached to a bottom surface of the printed circuit board in order to support the spindle motor. At least one part of the metal plate is contacted with the integration circuit through the printed circuit board. A second coupling hole and a contact protrusion(132) are formed in the metal plate. The contact protrusion is contacted with a bottom surface of the integration circuit through the printed circuit board, and penetrates the heat dissipation hole of the printed circuit board. A heat dissipation adhesive(133) is interposed between the contact protrusion and the integration circuit.