| 发明名称 |
USING SPECTRA TO DETERMINE POLISHING ENDPOINTS |
| 摘要 |
<p>Methods of determining a polishing endpoint are described using spectra obtained during a polishing sequence. In particular, techniques for using only desired spectra, faster searching methods and more robust rate determination methods are described.</p> |
| 申请公布号 |
EP2125291(A2) |
申请公布日期 |
2009.12.02 |
| 申请号 |
EP20080730580 |
申请日期 |
2008.02.22 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
LEE, HARRY Q.;SWEDEK, BOGUSLAW A.;BENVEGNU, DOMINIC J.;DAVID, JEFFREY DRUE |
| 分类号 |
B24B37/013;B24B49/00;B24B49/12;G06F19/00;H01L21/461 |
主分类号 |
B24B37/013 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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