| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed-wiring board where a resin layer with a uniform film thickness can be formed at both the surface and backside of a substrate. SOLUTION: A printed-wiring board is manufactured by forming an interlayer insulation layer 3 on both the sides of a substrate 1 by a rotor coater 4, where the substrate 1 has a surface-side conductor circuit 21 on the surface 11 and at the same time a backside conductor circuit 22 on the backside 12 and has a smaller area of the surface-side conductor circuit 21 than that of the backside conductor circuit 21. The application pressure of the interlayer insulation layer 3 on the backside 12 of the substrate 1 is smaller than that of the surface 11. |
