发明名称 METAL FILM AND FORMATION METHOD OF METAL FILM
摘要 <p>The present invention provides a metal film formed by applying an electroless plating catalyst or its precursor to a polymer layer on a base plate having a surface roughness of 500 nm or less and then carrying out electroless plating, the polymer layer containing a polymer which has a functional group capable of interacting with the electroless plating catalyst or its precursor and is chemically bonded directly to the base plate, wherein the adhesion strength between the base plate and the metal film is 0.2 kN/m or more.</p>
申请公布号 EP1859074(A4) 申请公布日期 2009.12.02
申请号 EP20060703140 申请日期 2006.01.13
申请人 FUJIFILM CORPORATION 发明人 KANO, TAKEYOSHI;KAWAMURA, KOICHI
分类号 C23C18/20;C23C18/28;C25D5/56 主分类号 C23C18/20
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