发明名称 |
METAL FILM AND FORMATION METHOD OF METAL FILM |
摘要 |
<p>The present invention provides a metal film formed by applying an electroless plating catalyst or its precursor to a polymer layer on a base plate having a surface roughness of 500 nm or less and then carrying out electroless plating, the polymer layer containing a polymer which has a functional group capable of interacting with the electroless plating catalyst or its precursor and is chemically bonded directly to the base plate, wherein the adhesion strength between the base plate and the metal film is 0.2 kN/m or more.</p> |
申请公布号 |
EP1859074(A4) |
申请公布日期 |
2009.12.02 |
申请号 |
EP20060703140 |
申请日期 |
2006.01.13 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
KANO, TAKEYOSHI;KAWAMURA, KOICHI |
分类号 |
C23C18/20;C23C18/28;C25D5/56 |
主分类号 |
C23C18/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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