| 摘要 |
PURPOSE: A heat radiation device for an amplifier in a vehicle is provided to improve productivity by assembling a heat sink, a PCB and a main chassis by top-down method. CONSTITUTION: A heat radiation device for an amplifier in a vehicle comprises a heat sink(10), a PCB(Printed Circuit Board,20), and a main chassis(30). A heat radiation fin(11) is formed on top of the heat sink to dissipate the heat generated inside. The PCB is equipped with a heat emitting element(21) emitting heat by electric resistance. The main chassis accommodates and support the PCB. Joint holes(40a,40b,40c) are formed in the heat sink, the PCB and the main chassis to vertically penetrate. A fastener(40) is engaged in the joint holes.
|
