| 摘要 |
PURPOSE: A flip chip package and a method of manufacturing the same are provided to a void in ultrasonic bonding by removing a step height between a pad open part and a coverlay and making underfill resin flowed smoothly. CONSTITUTION: In a flip chip package and a method of manufacturing the same, a coverlay(120) and a pad(110) protecting a circuit pattern are included on a substrate(100). A first bump(200) is formed on the pad top to remove the height of the coverlay and the top of it is flat. An electrode(310) is included in the semiconductor chip, and a second bump(400) is formed at the electrode, and it is adhered to the first bump through an ultrasonic wave and is electrically connected between the substrate and the semiconductor chip. The underfill resin(500) is filled between the substrate and the semiconductor chip, and the underfill resin is hardened. The first bump is formed to be as large as an exposed open part of the pad on the substrate.
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