RESIN-ENCAPSULATED TYPE SEMICONDUCTOR PACKAGES, AND PRODUCTION METHOD AND APPARATUS THEREFOR

摘要

THE PRESENT INVENTION IS CHARACTERIZED IN THAT A POWDERY OR GRANULAR RESIN COMPOSITION STIRRED AND MELTED IN AN AGITATING POT HAVING A HEATER, THE AGITATED AND MELTED RESIN COMPOSITION IS TAKEN OUT AND FORMED IN THE FORM OF A PACKAGE UNDER PRESSURE, AND THE FORMED RESIN A COMPOSITION IS FITTED TO A COMPRESSION PLUNGER INSIDE A CAVITY OF A LOWER MOLDING UNIT, A SEMICONDUCTOR PACKAGE IS MOLDED BY SEALING UNDER PRESSURIZING WITH THE COMPRESSION PLUNGER. EVEN WHEN THE WIRES ARE THINNED AND ARRANGED AT A HIGHER DENSITY, THE ABOVE PRODUCING METHOD CAN PROVIDE SUCH METHOD AND APPARATUS FOR PRODUCING THE RESIN SEALED TYPE SEMICONDUCTOR PACKAGES THAT PRODUCE LESS FLOWING OF THE WIRES.