ADHESIVE SHEET FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

摘要

Adhesive sheet for producing semiconductor device, semiconductor device, and manufacturing method thereof ABSTRACT OF THE DISCLOSURE An adhesive sheet (10) being strippably adhered to the lead frame or the wiring board, for manufacturing a semiconductor device of the present invention, which includes the heat-resistant base material and the adhesive layer (12) on one surface of the heat-resistant base material, wherein the adhesive layer (12) contains the then no setting resin (a) and the strippability imparting component (b). (Fig 1)