| 摘要 |
PLATING SOLUTION RECOVERY APPARATUS AND PLATING SOLUTION RECOVERY NETHOD A PLATING SOLUTION RECOVERY APPARATUS FOR 5 ELECTROPLATING, THE APPARATUS COMPRISES A CIRCULATION TANK; A SLUDGE REMOVING DEVICE; A CONCENTRATING DEVICE; AN IRON COMPOUND CRYSTALLIZING DEVICE; AN IRON COMPOUND SEPARATING DEVICE; AN IRON COMPOUND REDISSOLVING DEVICE; AN IRON ION REMOVING DEVICE; PIPELINES SEQUENTIALLY 10 CONNECTING THE CIRCULATION TANK, THE SLUDGE REMOVING DEVICE, THE CONCENTRATING DEVICE, THE IRON COMPOUND CRYSTALLIZING DEVICE, THE IRON COMPOUND SEPARATING DEVICE, THE IRON COMPOUND REDISSOLVING DEVICE, AND THEN THE IRON ION REMOVING DEVICE IN A DOWNSTREAM DIRECTION FROM A BASE 15 POINT COINCIDENT WITH THE CIRCULATION TANK; A PIPELINE CONNECTING FROM THE IRON ION REMOVING DEVICE TO THE CIRCULATION TANK; A PIPELINE CONNECTING FROM THE IRON COMPOUND SEPARATING DEVICE TO THE CIRCULATION TANK; AND A FLOW PATH CHANGING DEVICE CONNECTING TO THE CIRCULATION 20TANK AND PROVIDED IN AT LEAST ONE PORTION SELECTED FROM A GROUP OF PORTIONS, RESPECTIVELY, BETWEEN THE SLUDGE REMOVING DEVICE AND THE CONCENTRATING DEVICE, BETWEEN THE CONCENTRATING DE-VICE AND IRON COMPOUND CRYSTALLIZING DEVICE, AND BETWEEN THE IRON COMPOUND-CRYSTALLIZING DEVICE 25AND THE IRON COMPOUND SEPARATING DEVICE. WITH THE APPARATUS BEING USED, THE PLATING SOLUTION CAN BE RECOVERED IN THE MANNER THAT SLUDGE AND IRON ARE REMOVED FROM THE PLATING SOLUTION USED FOR ELECTROPLATING OF A
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