| 摘要 |
FIELD: printing industry. ^ SUBSTANCE: invention may be used in technological process of manual installation of surface-mounted components (SMC) onto circuit boards under conditions of experimental, pilot and small-scale multiproduct production. SMC 8 are installed onto circuit boards 2, surfaces of which in zones of soldering are previously coated with layer 13 of flux or soldering paste. On suction head 9 of vacuum pincers 6 vacuum is pulled, which provides for suction force F1, sufficient for reliable gripping and retention of SMC 8, but less than total force of adhesion engagement F2 of the latter to layer 13 of flux or solder paste. Separate SMC 8 gripped with the help of vacuum pincers 6 are transferred to circuit board 2 in area of their installation, afterwards they are separated from vacuum pincers without disconnection from vacuum. Separation of each SMC 8 from vacuum pincers 6 at the place of their installation is done by force F3, equal to difference between force of adhesive engagement F2 and suction force F1. Installation of components of various type is carried out serially. Each time prior to installation of SMC of another type, according value of vacuum is established on pincers. ^ EFFECT: reduced time of installation due to installation of various SMC types without application of additional devices for vacuum connection and disconnection. ^ 3 cl, 6 dwg |
