| 摘要 |
FIELD: electric engineering. ^ SUBSTANCE: invention can be used when soldering various elements of electronics items made from oxide dielectric materials to each other or to elements made from metals, and namely from copper or their alloys, and first of all elements of electrovacuum SHF items. Solder metal is obtained when melting initial components with the following ratio, wt %: germanium 7-12.5, manganese 0.08-1.2, gallium 0.05-0.5, and copper - the rest. ^ EFFECT: improving reliability of soldered connection, enlarging functional capabilities at maintaining economy of precious metals. ^ 2 cl, 1 tbl, 5 ex |
