| 摘要 |
FIELD: electricity. ^ SUBSTANCE: invention refers to contact assemblies on opposite contacts by means of which equipment is assembled from naked components, including erection of large-scale integration (LSI) chips in housings, as well as consisting of multichip modules. There proposed is contact assembly on opposite contacts, which consists at least of two flat contacts connected to each other electrically and mechanically with a connection element made from conducting material in the form of a connection strap. At that, each of the above contacts is located on flat surface of one of two coplanar carriers; contacts are directed towards each other relative to common axis which is orthogonal relative to coplanar carriers and which passes through centres of contacts, and gap between coplanar carriers of opposite contacts and around connection element is filled with dielectric material; at that, connection element is made in the form of a capillary with end flanges, which is filled, either partially or fully, with conducting bonding material drawn in the above capillary from opposite contacts on which it has been located before under influence of capillary forces which appear when conducting bonding material is changed to liquid state at process effect when assembling contact assembly so that mechanically resistant conducting connection is formed between opposite contacts after process effect is stopped; at that, the above capillary is made in the form of a hole the inner side of which is covered with the above wet conducting bonding material in plane parallel plate made from dielectric material, which is a capillary connection element carrier and is located in the gap between coplanar carriers of opposite contacts; at that, longitudinal capillary axis passes through centres of the above opposite contacts in orthogonal direction relative to surfaces of the above carriers of opposite contacts, and the above end flanges of capillary, which are located on surfaces of the above plane parallel carrier of capillary connection element, are end-to-end connected to opposite contacts and mechanically and electrically connected to them by means of a thin layer of the above conducting bonding material. ^ EFFECT: providing increased reliability of devices owing to increasing strength characteristics of contact assembly, and resistance to thermal cycles. ^ 35 cl, 35 dwg, 1 tbl |
