发明名称 ELECTRONIC COMPONENT PACKAGING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To ensure high packaging quality by continuously stabilizing a pressing load even in long-time pressing. <P>SOLUTION: A VCM 3 is brought into a pressed state under current control, a servo motor 6 is controlled in position, a nozzle 1 is moved down to a mounting position, and it is confirmed that an electronic component P is abutted to a circuit board S. Further, the electronic component P is moved down just by a predetermined push-in amount, the VCM 3 is switched from current control to load feedback control and raised to an initial achievement load P<SB>1</SB>for an optional time T<SB>0</SB>and after the lapse of an optional time T<SB>1</SB>during which the load P<SB>1</SB>is stabilized, the load feedback control is switched to current control for pressing load just for a predetermined time. After the lapse of the optional time T<SB>1</SB>within which the load P<SB>1</SB>is stabilized, the load feedback control is not performed but switched to the current control, thereby suppressing drift without being affected by instability in pressing load with the passage of time. A generation rate of a junction defect can be reduced by the load stabilization. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009277920(A) 申请公布日期 2009.11.26
申请号 JP20080128288 申请日期 2008.05.15
申请人 PANASONIC CORP 发明人 HOSOYA NAOTO;KAWAI TAMOTSU
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
主权项
地址