| 摘要 |
PROBLEM TO BE SOLVED: To provide a relatively compact cleaning device including a cleaning unit for cleaning the protective film of a ground wafer and the other cleaning unit for cleaning the suction section of a conveyance unit. SOLUTION: There is provided the cleaning device (40) including a first cleaning means (50) for, when the backside (22) of a wafer (20) is sucked by a suction part (36) of a conveyance unit (35), cleaning a protective film (3) attached to the surface (21) of the wafer; a second cleaning means (60) for cleaning the suction section of the conveyance unit when the wafer is not sucked; and an elevating means (46) for relatively elevating the first cleaning means to the second cleaning means. Preferably, a first cleaning member (55) of the first cleaning means is a sponge or a brush, and a second cleaning member (65) of the second cleaning means is a grinding stone. COPYRIGHT: (C)2010,JPO&INPIT
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