发明名称 BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a bonding method capable of omitting mixing of a base resin with a hardener before applying a two-component adhesive to adherends, provided that the bonding method is the one intended to achieve simplification and laborsaving of a bonding operation when bonding adherends by omitting a step of mixing a base resin and a hardener, which has been conventionally carried out when using two-component adhesives. SOLUTION: The bonding method comprises applying a base resin to one of the adherends and applying a hardener to the other adherend without mixing a base resin and a hardener of the two-component adhesive and subsequently bonding the adhesive-applied surfaces of the adherends to each other. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009275160(A) 申请公布日期 2009.11.26
申请号 JP20080129126 申请日期 2008.05.16
申请人 TORAY FINE CHEMICALS CO LTD 发明人 KAGEISHI KAZUJI;KASUYA CHIEMI;ANDO ARIYOSHI
分类号 C09J5/04;C09J133/14;C09J151/00 主分类号 C09J5/04
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