LIGHT EMITTING DIODE DEVICE

摘要

An exemplary light emitting diode (LED) device includes a base, a plurality of LED chips, a plurality of encapsulation materials and a heat dissipation substrate. The LED chips are mounted on a top surface of the base. The encapsulation materials are provided on the top surface of the base and encapsulate the LED chips therein. The heat dissipation substrate is fixedly attached to a bottom surface of the base. The heat dissipation substrate is of a porous material and defines a plurality of pores therein. The pores communicate with each other.