| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus and method for manufacturing electronic components, which improves the yield without markedly lowering productivity. <P>SOLUTION: The apparatus for manufacturing electronic components has a structure that includes: a loading means 5 for loading an electronic component 1 on a mounting substrate 2; a driving means 8 for bringing the loading means close to and separate from the mounting substrate; a position detecting means 9 for detecting the current position of the loading means; a heating means 7 for heating the loading means for melting solder; and a control means 10 for reading position information from the position detecting means, reading temperature information from the heating means, and controlling the driving means and heating means, the control means 10 having a function of controlling the heating time by determining the bonding status of the solder, based on the position information read from the position detecting means. <P>COPYRIGHT: (C)2010,JPO&INPIT |
