| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board with an embedded component that efficiently dissipate heat generated by the embedded component. <P>SOLUTION: The printed circuit board with the embedded component includes the embedded component 21 mounted on the component mounting surface of the substrate 11 and having its periphery covered with an insulating layer 13, an inner packaging pattern PA for heat dissipation formed on a side opposite to the component mounting surface of the substrate 11 with the embedded component 21 therebetween which dissipates heat generated by the embedded component 21, and an outer packaging pattern 16 for heat dissipation connected to the inner packaging pattern PA for heat dissipation. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
