| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture a circuit module of such a kind that an electronic component mounted on a substrate is embedded in a resin layer to be insulated and a conductive shield layer is provided thereupon to shield the electronic component at a low price with a good efficiency percentage without half-cutting the substrate. <P>SOLUTION: On a ground electrode 7 of an assembled substrate 1a prepared in a first stage, a conductive member 4a is provided taller than the electronic component 3 mounted in a region of each slave substrate 11. In a second stage, the insulating resin layer 5 is provided to embed the electronic component 3, and at least an upper end surface of the conductive member 4a is exposed from the resin layer 5. In a third stage, the shield layer 6 is provided thereupon to come into contact with at least the upper end surface of the conductive member 4a and in a fourth stage, the assembled substrate 1a is cut into regions of slave substrates 11, thereby manufacturing the circuit module 2 such that the upper surface side of the electronic component 3 is shielded and side surfaces are shielded without half-cutting the assembled substrate 1a. <P>COPYRIGHT: (C)2010,JPO&INPIT |
