| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film carrier tape for mounting an electronic component having high connection reliability, a method for manufacturing the film carrier tape, and a semiconductor device using the film carrier tape. Ž<P>SOLUTION: The film carrier tape 10 for mounting the electronic component comprises: an inner lead 20 connected to the electronic component 50 through a bump electrode 52 formed on the electronic component 50 for processing an input/output signal from the electronic component; and an outer lead for input/output processing of a signal from the inner lead 20 through a wiring pattern. A fitting concave part 54 with the bump electrode 52 fit-connected therein is formed to the inner lead 20 for connecting with the bump electrode 52 formed to the electronic component 50. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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