| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having an electrode pad which can be improved in area efficiency. SOLUTION: The semiconductor device includes: an internal circuit region 13 disposed on a rectangular semiconductor substrate 11 and an input/output circuit region 15 at a peripheral part of the internal circuit region 13; a probe inspection pad 21 where a plurality of quadrangular basic pads 20 in the same shape are connected to the input/output circuit region 15 on an upper-surface side of the input/output circuit region 15 are put one over another through translating operation T1 so that part of a side of each basic pad 20 is identified and which has an external shape formed by sides of the outermost basic pad 20; and a bonding pad 26 connected to the probe inspection pad 21. COPYRIGHT: (C)2010,JPO&INPIT
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