HEAT-RESISTANT RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a heat-resistant resin composition exhibiting a high rate of oxazole formation even at a low heat curing temperature, and having high preservation stability, and to provide a heat-resistant resin composition having high sensitivity in addition to the exhibition of the high rate of the oxazole formation even by using the low heat curing temperature when a light-sensitive diazoquinone compound is contained. SOLUTION: The heat-resistant resin composition contains (B) 1-50 pts.mass of at least one compound selected from the group consisting of a polyester compound having≥300 number average molecular weight and a polyalkylene glycol having≥200 number average molecular weight based on (A) 100 pts.mass of a hydroxy polyamide having a repeating unit represented by a specific general formula. COPYRIGHT: (C)2010,JPO&INPIT