SYSTEMS HAVING COMPONENTS COUPLED WITH ELECTROSTATIC DISSIPATIVE ADHESIVE
摘要
A system in one embodiment includes a substrate; a thin film structure coupled to the substrate, the thin film structure comprising at least one of read transducers and write transducers; a closure; and an electrostatically dissipative adhesive coupling the closure to at least one of the thin film structure and the substrate. The adhesive comprises a mixture comprising: an adhesive material; and electrically conductive particles intermixed with the adhesive material, the electrically conductive particles being present in an amount between 0 and about 10% by weight of a total weight of the mixture. The closure defines at least a portion of a tape bearing surface. Additional systems and methods are also presented.
申请公布号
WO2009141231(A2)
申请公布日期
2009.11.26
申请号
WO2009EP55510
申请日期
2009.05.07
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION;IBM UNITED KINGDOM LIMITED;BANDY, WILLIAM, IV;IBEN, ICKO;MCKINLEY, WAYNE