| 摘要 |
In a load port mechanism of a substrate treatment unit, protuberances are provided on a sealing surface formed along a door with which a wafer carrier is to dock, or on a sealing surface formed around the door of the wafer carrier. The wafer carrier door is faced with the load port door with the protuberances therebetween, thereby separating the sealing surface of the substrate treatment unit from the sealing surface of the wafer carrier by only a predetermined distance. Thus, there is formed a channel along which clean air flows from the inside of the substrate treatment unit to the outside thereof. The load port structure and the wafer carrier structure improve the reliability of opening/closing action of the wafer carrier and prevent entry of extraneous particles into the treatment unit with sufficient reliability, and enable high-yield production of integrated circuits.
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