发明名称 |
WIRE BONDING PROCESS FOR INSULATED WIRES |
摘要 |
A process for bonding insulated wires is provided wherein a conforming free air ball is formed from an insulated wire to create a ball bond. A tip of the insulated wire is first positioned close to an electronic flame-off device and a first electric discharge is produced from the electronic flame-off device to melt the tip of the insulated wire and produce a pilot ball. The electric discharge is then terminated. A second electric discharge is then generated to produce the conforming free air ball, and thereafter, the conforming free air ball is attached to a bonding surface to create the ball bond. |
申请公布号 |
SG156688(A1) |
申请公布日期 |
2009.11.26 |
申请号 |
SG20090071622 |
申请日期 |
2007.05.07 |
申请人 |
ASM TECHNOLOGY SINGAPORE PTE LTD;MICROBONDS INC |
发明人 |
MALLIAH RAMKUMAR;AIK LIM LOON;VATH III CHARLES J.;CHRISTOPHER CARR;ROBERT LYN;JOHN PERSIC;YOUNG-KYU SONG |
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