发明名称 Semiconductor device and a semiconductor device manufacturing method
摘要 A semiconductor device for fingerprint sensors reduces a mounting area of the semiconductor device and improves a processing capacity of assembling and testing process. The semiconductor device has a functional surface that provides a predetermined function. A semiconductor element has a circuit formation surface on which a plurality of electrodes are formed and a back surface opposite to the circuit formation surface. A part of the circuit formation surface functions as the functional surface. Wiring is formed on the back surface of the semiconductor element. A plurality of connection parts extends between the circuit formation surface and the back surface of the semiconductor element so as to electrically connect the electrodes to the wiring. A plurality of external connection terminals are exposed outside the semiconductor device on a side of the back surface of the semiconductor element.
申请公布号 US2009291515(A1) 申请公布日期 2009.11.26
申请号 US20090458995 申请日期 2009.07.29
申请人 FUJITSU MICROELECTRONICS LIMITED 发明人 FUKASAWA NORIO
分类号 H01L21/66;H01L21/78 主分类号 H01L21/66
代理机构 代理人
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