发明名称 |
Semiconductor device and a semiconductor device manufacturing method |
摘要 |
A semiconductor device for fingerprint sensors reduces a mounting area of the semiconductor device and improves a processing capacity of assembling and testing process. The semiconductor device has a functional surface that provides a predetermined function. A semiconductor element has a circuit formation surface on which a plurality of electrodes are formed and a back surface opposite to the circuit formation surface. A part of the circuit formation surface functions as the functional surface. Wiring is formed on the back surface of the semiconductor element. A plurality of connection parts extends between the circuit formation surface and the back surface of the semiconductor element so as to electrically connect the electrodes to the wiring. A plurality of external connection terminals are exposed outside the semiconductor device on a side of the back surface of the semiconductor element.
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申请公布号 |
US2009291515(A1) |
申请公布日期 |
2009.11.26 |
申请号 |
US20090458995 |
申请日期 |
2009.07.29 |
申请人 |
FUJITSU MICROELECTRONICS LIMITED |
发明人 |
FUKASAWA NORIO |
分类号 |
H01L21/66;H01L21/78 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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