CATALYST-IMPARTING LIQUID FOR SOLDER PLATING

摘要

A catalyst-imparting liquid which, when used in conducting electroless reductional solder plating directly on a copper-based conductor circuit material, can give an even coating film free from thickness unevenness and enables the formation of a solder deposit having no bridge between fine wiring lines.  Also provided is a solder deposit formed using the catalyst-imparting liquid.  The catalyst-imparting liquid, which is for conducting electroless reductional solder plating on a copper-based metal, is characterized by comprising a water-soluble gold compound and a chelating agent.  The deposit is a solder deposit formed on a copper-based metal, and is characterized by being obtained by using the catalyst-imparting liquid to conduct electroless reductional solder plating.  Furthermore provided is a solder deposit formed over a copper-based metal which has gold in an amount of 3×10-5 g/cm2 or smaller on the surface thereof, the deposit having been formed on the gold.